Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2017-09-26 | $25,046,000 |
ML
Mark A. Lamb — 1 Patent in 2017
Overall (2017): #321,841 of 506,227Top 65%
1
Patents 2017