Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2017-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Thomas A. Kocian | 2017-09-26 |