Issued Patents 2017
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831165 | Interposer substrate and method of manufacturing the same | Che-Wei Hsu, Chih-Wen Liu | 2017-11-28 |
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-11-28 |
| 9824964 | Package substrate, package structure including the same, and their fabrication methods | Chun-Hsien Yu | 2017-11-21 |
| 9806012 | IC carrier of semiconductor package and manufacturing method thereof | Chao-Tsung Tseng | 2017-10-31 |
| 9805996 | Substrate structure and manufacturing method thereof | Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-10-31 |
| 9754982 | Packaging module and substrate structure thereof | Chun-Hsien Yu, Chu-Chin Hu | 2017-09-05 |
| 9750142 | Method for manufacturing an electronic package | — | 2017-08-29 |
| 9741646 | Package substrate and its fabrication method | Chin-Yao Hsu | 2017-08-22 |
| 9730328 | Printed circuit board with embedded component and method for manufacturing same | — | 2017-08-08 |
| 9711445 | Package substrate, package structure including the same, and their fabrication methods | Chun-Hsien Yu | 2017-07-18 |
| 9613894 | Electronic package | Chu-Chin Hu | 2017-04-04 |
| 9601402 | Package apparatus and manufacturing method thereof | E-Tung Chou, Chu-Chin Hu | 2017-03-21 |
| 9589935 | Package apparatus and manufacturing method thereof | Chu-Chin Hu, E-Tung Chou | 2017-03-07 |
| 9583436 | Package apparatus and manufacturing method thereof | Chao-Tsung Tseng, Chin-Ming Liu, Che-Wei Hsu | 2017-02-28 |
| 9548234 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2017-01-17 |
| 9536864 | Package structure and its fabrication method | — | 2017-01-03 |