Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2017-11-28 |
| 9805996 | Substrate structure and manufacturing method thereof | Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2017-10-31 |
| 9583436 | Package apparatus and manufacturing method thereof | Chao-Tsung Tseng, Shih-Ping Hsu, Che-Wei Hsu | 2017-02-28 |