Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831217 | Method of fabricating package substrates | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2017-11-28 |
| 9754982 | Packaging module and substrate structure thereof | Chun-Hsien Yu, Shih-Ping Hsu | 2017-09-05 |
| 9613894 | Electronic package | Shih-Ping Hsu | 2017-04-04 |
| 9601402 | Package apparatus and manufacturing method thereof | E-Tung Chou, Shih-Ping Hsu | 2017-03-21 |
| 9589935 | Package apparatus and manufacturing method thereof | Shih-Ping Hsu, E-Tung Chou | 2017-03-07 |