Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852977 | Package substrate | Pao-Hung Chou | 2017-12-26 |
| 9824964 | Package substrate, package structure including the same, and their fabrication methods | Shih-Ping Hsu | 2017-11-21 |
| 9754982 | Packaging module and substrate structure thereof | Chu-Chin Hu, Shih-Ping Hsu | 2017-09-05 |
| 9711445 | Package substrate, package structure including the same, and their fabrication methods | Shih-Ping Hsu | 2017-07-18 |