PC

Pao-Hung Chou

PC Phoenix Pioneer Technology Co.: 2 patents #6 of 12Top 50%
UT Unimicron Technology: 1 patents #12 of 29Top 45%
📍 Hukou, TW: #2 of 5 inventorsTop 40%
Overall (2017): #64,478 of 506,227Top 15%
3
Patents 2017

Issued Patents 2017

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
9852977 Package substrate Chun-Hsien Yu 2017-12-26
9806050 Method of fabricating package structure Chih-Hao Hsu 2017-10-31
9780022 Substrate structure — 2017-10-03