Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831217 | Method of fabricating package substrates | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2017-11-28 |
| 9805996 | Substrate structure and manufacturing method thereof | Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2017-10-31 |