Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806047 | Wafer level device and method with cantilever pillar structure | Peter R. Harper, Sriram Muthukumar, Arkadii V. Samoilov | 2017-10-31 |
| 9721912 | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality | Viren Khandekar, Vivek Swaminathan Sridharan | 2017-08-01 |