Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837368 | Enhanced board level reliability for wafer level packages | Martin Mason, Arkadii V. Samoilov | 2017-12-05 |
| 9806047 | Wafer level device and method with cantilever pillar structure | Karthik Thambidurai, Sriram Muthukumar, Arkadii V. Samoilov | 2017-10-31 |
| 9726689 | Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope | Hemant D. Desai, Demetre Kondylis | 2017-08-08 |
| 9564415 | Semiconductor package device having passive energy components | — | 2017-02-07 |