Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9726689 | Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope | Hemant D. Desai, Peter R. Harper | 2017-08-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9726689 | Wafer level micro-electro-mechanical systems package with accelerometer and gyroscope | Hemant D. Desai, Peter R. Harper | 2017-08-08 |