Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851250 | Fully integrated gas concentration sensor | Arvin Emadi, Nicole D. Kerness | 2017-12-26 |
| 9837368 | Enhanced board level reliability for wafer level packages | Peter R. Harper, Martin Mason | 2017-12-05 |
| 9806047 | Wafer level device and method with cantilever pillar structure | Karthik Thambidurai, Peter R. Harper, Sriram Muthukumar | 2017-10-31 |
| 9704809 | Fan-out and heterogeneous packaging of electronic components | Khanh Tran, Pirooz Parvarandeh, Amit S. Kelkar | 2017-07-11 |
| 9659900 | Semiconductor device having a die and through-substrate via | Xuejun Ying, Peter McNally, Tyler Parent | 2017-05-23 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar Rahim, Viren Khandekar +1 more | 2017-02-28 |
| 9558390 | High-resolution electric field sensor in cover glass | Richard S. Withers, Ronald B. Koo, Stephen C. Gerber, David Johnson | 2017-01-31 |