Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721912 | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality | Karthik Thambidurai, Vivek Swaminathan Sridharan | 2017-08-01 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar Rahim, Yi-Sheng Anthony Sun +1 more | 2017-02-28 |