Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9704726 | Packaging structural member | Chin Hock Toh, Xue Ren Zhang, Ravi Kanth Kolan | 2017-07-11 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar Rahim, Viren Khandekar +1 more | 2017-02-28 |