Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721912 | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality | Viren Khandekar, Karthik Thambidurai | 2017-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721912 | Wafer-level chip-scale package device having bump assemblies configured to furnish shock absorber functionality | Viren Khandekar, Karthik Thambidurai | 2017-08-01 |