Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721921 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, Lan H. Hoang, Pandi C. Marimuthu +3 more | 2017-08-01 |
| 9631614 | Oil supply system | Jong Hyun Kim, Taeho Kim, Seungjae Kang | 2017-04-25 |
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | Hyunil Bae, Myungkil Lee | 2017-01-31 |