Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | Hyunil Bae, YoungChul Kim | 2017-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | Hyunil Bae, YoungChul Kim | 2017-01-31 |