Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | YoungChul Kim, Myungkil Lee | 2017-01-31 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559046 | Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias | YoungChul Kim, Myungkil Lee | 2017-01-31 |