Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837341 | Tin-zinc microbump structures | Amanda E. Schuckman, Kyu Oh Lee | 2017-12-05 |
| 9728500 | Integrated circuit surface layer with adhesion-functional group | Siddharth K. Alur, Robert Alan May, Whitney Bryks | 2017-08-08 |