Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824999 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Simon J. S. McElrea, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson | 2017-11-21 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Ashok S. Prabhu, Sangil Lee, Liang Wang +1 more | 2017-11-21 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Roseann Alatorre, Javier A. Delacruz | 2017-05-23 |