Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-12-05 |
| 9780052 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Wayne H. Huang, Anilkumar Chandolu, Mark Bossler | 2017-10-03 |
| 9768149 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Jaspreet S. Gandhi, James M. Derderian | 2017-09-19 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2017-06-27 |
| 9647167 | Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods | — | 2017-05-09 |