| 9847289 |
Protective via cap for improved interconnect performance |
Paul F. Ma, Srinivas D. Nemani |
2017-12-19 |
| 9847252 |
Methods for forming 2-dimensional self-aligned vias |
Bencherki Mebarki, Srinivas D. Nemani |
2017-12-19 |
| 9793108 |
Interconnect integration for sidewall pore seal and via cleanliness |
He Ren, Deenesh Padhi, Priyanka DASH, Bhaskar Kumar, Alexandros T. Demos |
2017-10-17 |
| 9761489 |
Self-aligned interconnects formed using substractive techniques |
Bencherki Mebarki, Huixiong Dai, Yongmei Chen, He Ren |
2017-09-12 |
| 9711397 |
Cobalt resistance recovery by hydrogen anneal |
Nikolaos Bekiaris, Zhiyuan Wu |
2017-07-18 |
| 9640424 |
Integrated metal spacer and air gap interconnect |
He Ren |
2017-05-02 |
| 9613859 |
Direct deposition of nickel silicide nanowire |
Annamalai Lakshmanan, Bencherki Mebarki, Kaushal K. Singh, Paul F. Ma, Andrew Cockburn +1 more |
2017-04-04 |
| 9601431 |
Dielectric/metal barrier integration to prevent copper diffusion |
He Ren, Yong Cao, Mei-Yee Shek, Yana Cheng, Sree Rangasai V. Kesapragada |
2017-03-21 |
| 9570345 |
Cobalt resistance recovery by hydrogen anneal |
Nikolaos Bekiaris, Zhiyuan Wu |
2017-02-14 |
