| 9748227 |
Dual-sided silicon integrated passive devices |
Jun Zhai, Vidhya Ramachandran, Mengzhi Pang, Chonghua Zhong |
2017-08-29 |
| 9691701 |
SOC with integrated voltage regulator using preformed MIM capacitor wafer |
Jun Zhai |
2017-06-27 |
| 9679801 |
Dual molded stack TSV package |
Kwan-Yu Lai, Jun Zhai, Flynn Carson |
2017-06-13 |
| 9659907 |
Double side mounting memory integration in thin low warpage fanout package |
Jun Zhai, Chonghua Zhong, Mengzhi Pang, Se Young Yang |
2017-05-23 |
| 9633974 |
System in package fan out stacking architecture and process flow |
Jun Zhai, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang |
2017-04-25 |
| 9601471 |
Three layer stack structure |
Jun Zhai |
2017-03-21 |
| 9589936 |
3D integration of fanout wafer level packages |
Jun Zhai, Flynn Carson |
2017-03-07 |
| 9559081 |
Independent 3D stacking |
Kwan-Yu Lai, Jun Zhai |
2017-01-31 |
