Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842810 | Tiled-stress-alleviating pad structure | Ekta Misra, Mukta G. Farooq | 2017-12-12 |
| 9837333 | Electronic package cover having underside rib | Kamal K. Sikka | 2017-12-05 |
| 9754905 | Final passivation for wafer level warpage and ULK stress reduction | Ekta Misra | 2017-09-05 |
| 9563732 | In-plane copper imbalance for warpage prediction | Anson J. Call, Vijayeshwar D. Khanna, David J. Russell | 2017-02-07 |