Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659131 | Copper feature design for warpage control of substrates | Edmund Blackshear, Anson J. Call, Vijayeshwar D. Khanna, Douglas O. Powell | 2017-05-23 |
| 9613915 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, Peter Slota, Jr. +1 more | 2017-04-04 |
| 9585257 | Method of forming a glass interposer with thermal vias | Jeffrey P. Gambino, Richard S. Graf, Sudeep Mandal | 2017-02-28 |
| 9563732 | In-plane copper imbalance for warpage prediction | Anson J. Call, Vijayeshwar D. Khanna, Krishna R. Tunga | 2017-02-07 |
| 9543255 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, Peter Slota, Jr. +1 more | 2017-01-10 |