Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659131 | Copper feature design for warpage control of substrates | Edmund Blackshear, Anson J. Call, Douglas O. Powell, David J. Russell | 2017-05-23 |
| 9630269 | Mechanism to attach a die to a substrate | Mohammed S. Shaikh | 2017-04-25 |
| 9563732 | In-plane copper imbalance for warpage prediction | Anson J. Call, David J. Russell, Krishna R. Tunga | 2017-02-07 |
| 9550258 | Method and system for thermomechanically decoupling heatsink | Sri M. Sri-Jayantha, Gerard McVicker | 2017-01-24 |