Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818693 | Through-memory-level via structures for a three-dimensional memory device | Fumiaki Toyama, Hiroyuki Ogawa, Yoko Furihata, James Kai, Yuki Mizutani +2 more | 2017-11-14 |
| 9818759 | Through-memory-level via structures for a three-dimensional memory device | James Kai, Jin Liu, Johann Alsmeier, Yoko Furihata, Hiroyuki Ogawa | 2017-11-14 |
| 9728551 | Multi-tier replacement memory stack structure integration scheme | Ching-Huang Lu, Zhenyu Lu, Daxin Mao, Johann Alsmeier, Wenguang Shi +1 more | 2017-08-08 |
| 9673213 | Three dimensional memory device with peripheral devices under dummy dielectric layer stack and method of making thereof | Yanli Zhang, Zhenyu Lu, Johann Alsmeier, Daxin Mao | 2017-06-06 |