Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831266 | Three-dimensional NAND device containing support pedestal structures for a buried source line and method of making the same | James Kai, Johann Alsmeier, Yanli Zhang | 2017-11-28 |
| 9818759 | Through-memory-level via structures for a three-dimensional memory device | James Kai, Johann Alsmeier, Jixin Yu, Yoko Furihata, Hiroyuki Ogawa | 2017-11-14 |
| 9818693 | Through-memory-level via structures for a three-dimensional memory device | Fumiaki Toyama, Hiroyuki Ogawa, Yoko Furihata, James Kai, Yuki Mizutani +2 more | 2017-11-14 |
| 9799670 | Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof | Masatoshi Nishikawa, Chun Ge, Yanli Zhang | 2017-10-24 |
| 9780112 | Methods and apparatus for three-dimensional NAND non-volatile memory devices with side source line and mechanical support | Chun Ge, Johann Alsmeier | 2017-10-03 |
| 9698153 | Vertical NAND and method of making thereof using sequential stack etching and self-aligned landing pad | Yanli Zhang, Murshed Chowdhury, Raghuveer S. Makala, Johann Alsmeier | 2017-07-04 |
| 9627403 | Multilevel memory stack structure employing support pillar structures | Tong Zhang, Jayavel Pachamuthu, Yao-Sheng Lee, Johann Alsmeier | 2017-04-18 |
| 9576975 | Monolithic three-dimensional NAND strings and methods of fabrication thereof | Yanli Zhang, James Kai, Raghuveer S. Makala, Murshed Chowdhury, Camilla Huang +1 more | 2017-02-21 |
| 9570463 | Multilevel memory stack structure with joint electrode having a collar portion and methods for manufacturing the same | Yanli Zhang, Raghuveer S. Makala, Murshed Chowdhury, Yao-Sheng Lee, Johann Alsmeier | 2017-02-14 |