Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852988 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2017-12-26 |
| 9659848 | Stiffened wires for offset BVA | Grant Villavicencio, Sangil Lee, Roseann Alatorre, Scott McGrath | 2017-05-23 |
| 9595511 | Microelectronic packages and assemblies with improved flyby signaling operation | Belgacem Haba, Zhuowen Sun | 2017-03-14 |