Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852988 | Increased contact alignment tolerance for direct bonding | Paul M. Enquist, Javier A. Delacruz | 2017-12-26 |
| 9716033 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2017-07-25 |
| 9698126 | Heterogeneous annealing method and device | Paul M. Enquist | 2017-07-04 |
| 9564414 | Three dimensional device integration method and integrated device | Paul M. Enquist | 2017-02-07 |