| 9799618 |
Mixed UBM and mixed pitch on a single die |
Charles L. Arvin |
2017-10-24 |
| 9798088 |
Barrier structures for underfill blockout regions |
Jeffrey P. Gambino, Robert K. Leidy, Wolfgang Sauter, Eric Turcotte, Thomas E. Lombardi |
2017-10-24 |
| 9741682 |
Structures to enable a full intermetallic interconnect |
Charles L. Arvin, Wolfgang Sauter |
2017-08-22 |
| 9679806 |
Nanowires for pillar interconnects |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2017-06-13 |
| 9633962 |
Plug via formation with grid features in the passivation layer |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Wolfgang Sauter |
2017-04-25 |
| 9613921 |
Structure to prevent solder extrusion |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2017-04-04 |
| 9607862 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2017-03-28 |
| 9583451 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2017-02-28 |
