| 9754823 |
Substrate including selectively formed barrier layer |
Yuri M. Brovman, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler |
2017-09-05 |
| 9748135 |
Substrate including selectively formed barrier layer |
Yuri M. Brovman, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler |
2017-08-29 |
| 9735071 |
Method of forming a temporary test structure for device fabrication |
Charles L. Arvin, Gary W. Maier |
2017-08-15 |
| 9728440 |
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer |
Charles L. Arvin, Harry D. Cox, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler |
2017-08-08 |
| 9640492 |
Laminate warpage control |
Charles L. Arvin, Brian W. Quinlan |
2017-05-02 |
| 9601423 |
Under die surface mounted electrical elements |
Charles L. Arvin, Jon A. Casey, Steven P. Ostrander, Brian W. Quinlan |
2017-03-21 |
| 9565777 |
Security mesh and method of making |
Charles L. Arvin |
2017-02-07 |
