Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2017-12-26 |
| 9793132 | Etch mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, James S. Papanu, Ramesh Krishnamurthy, Prabhat Kumar, Ajay Kumar +1 more | 2017-10-17 |
| 9768014 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Ajay Kumar | 2017-09-19 |
| 9721839 | Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Ajay Kumar | 2017-08-01 |
| 9620379 | Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Todd Egan, Madhava Rao Yalamanchili, Ajay Kumar | 2017-04-11 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Jungrae Park, Ajay Kumar, James S. Papanu, Prabhat Kumar | 2017-03-21 |
| 9583375 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, James S. Papanu, Ajay Kumar | 2017-02-28 |