| 9852997 |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process |
Jungrae Park, James S. Papanu, Brad Eaton, Ajay Kumar |
2017-12-26 |
| 9768014 |
Wafer coating |
Jungrae Park, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar |
2017-09-19 |
| 9721839 |
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch |
Mohammad Kamruzzaman Chowdhury, Brad Eaton, Ajay Kumar |
2017-08-01 |
| 9620379 |
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch |
Mohammad Kamruzzaman Chowdhury, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar |
2017-04-11 |
| 9601375 |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach |
Brad Eaton, Jungrae Park, Ajay Kumar, James S. Papanu, Prabhat Kumar |
2017-03-21 |
| 9583375 |
Water soluble mask formation by dry film lamination |
James S. Papanu, Brad Eaton, Ajay Kumar |
2017-02-28 |
