Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721839 | Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2017-08-01 |
| 9620379 | Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Todd Egan, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2017-04-11 |