Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Jungrae Park, Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2017-12-26 |
| 9793132 | Etch mask for hybrid laser scribing and plasma etch wafer singulation process | Wenguang Li, Ramesh Krishnamurthy, Prabhat Kumar, Brad Eaton, Ajay Kumar +1 more | 2017-10-17 |
| 9768014 | Wafer coating | Jungrae Park, Wei-Sheng Lei, Prabhat Kumar, Brad Eaton, Ajay Kumar | 2017-09-19 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Brad Eaton, Jungrae Park, Ajay Kumar, Prabhat Kumar | 2017-03-21 |
| 9583375 | Water soluble mask formation by dry film lamination | Wei-Sheng Lei, Brad Eaton, Ajay Kumar | 2017-02-28 |