Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852997 | Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process | Wei-Sheng Lei, James S. Papanu, Brad Eaton, Ajay Kumar | 2017-12-26 |
| 9768014 | Wafer coating | Wei-Sheng Lei, Prabhat Kumar, James S. Papanu, Brad Eaton, Ajay Kumar | 2017-09-19 |
| 9601375 | UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach | Wei-Sheng Lei, Brad Eaton, Ajay Kumar, James S. Papanu, Prabhat Kumar | 2017-03-21 |