Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659131 | Copper feature design for warpage control of substrates | Edmund Blackshear, Vijayeshwar D. Khanna, Douglas O. Powell, David J. Russell | 2017-05-23 |
| 9633914 | Split ball grid array pad for multi-chip modules | Erwin B. Cohen, Dany Minier, Wolfgang Sauter, David B. Stone, Eric W. Tremble | 2017-04-25 |
| 9563732 | In-plane copper imbalance for warpage prediction | Vijayeshwar D. Khanna, David J. Russell, Krishna R. Tunga | 2017-02-07 |