Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9844134 | Device including a metallization layer and method of manufacturing a device | Markus Heinrici, Stefan Schwab | 2017-12-12 |
| 9818602 | Method of depositing a resin material on a semiconductor body with an inkjet process | Stefan Schwab, Markus Heinrici, Rafael Janski, Susanne Kraeuter | 2017-11-14 |
| 9793119 | Method for structuring a substrate using a protection layer as a mask | Markus Heinrici, Florian Bernsteiner | 2017-10-17 |
| 9786568 | Method of manufacturing an integrated circuit substrate | Claudia Sgiarovello, Andrew Christopher Graeme Wood | 2017-10-10 |
| 9768023 | Method for structuring a substrate | Markus Heinrici, Florian Bernsteiner | 2017-09-19 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Markus Heinrici, Gudrun Stranzl, Martin Zgaga | 2017-06-06 |
| 9640419 | Carrier system for processing semiconductor substrates, and methods thereof | Manfred Schneegans, Michael Roesner, Michael Pinczolits | 2017-05-02 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Markus Heinrici, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2017-04-11 |