Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9844134 | Device including a metallization layer and method of manufacturing a device | Martin Mischitz, Stefan Schwab | 2017-12-12 |
| 9818602 | Method of depositing a resin material on a semiconductor body with an inkjet process | Stefan Schwab, Rafael Janski, Susanne Kraeuter, Martin Mischitz | 2017-11-14 |
| 9793119 | Method for structuring a substrate using a protection layer as a mask | Martin Mischitz, Florian Bernsteiner | 2017-10-17 |
| 9768023 | Method for structuring a substrate | Martin Mischitz, Florian Bernsteiner | 2017-09-19 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Gudrun Stranzl, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Martin Mischitz, Barbara Eichinger, Manfred Schneegans, Stefan Krivec | 2017-04-11 |