Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9780053 | Method of forming a bondpad and bondpad | Magdalena Hoier, Peter Scherl | 2017-10-03 |
| 9666546 | Multi-layer metal pads | Bernhard Weidgans, Franziska Haering | 2017-05-30 |
| 9640419 | Carrier system for processing semiconductor substrates, and methods thereof | Martin Mischitz, Michael Roesner, Michael Pinczolits | 2017-05-02 |
| 9620466 | Method of manufacturing an electronic device having a contact pad with partially sealed pores | Martin Mischitz, Markus Heinrici, Barbara Eichinger, Stefan Krivec | 2017-04-11 |