MH

Magdalena Hoier

Infineon Technologies Ag: 2 patents #173 of 917Top 20%
📍 Regensburg, DE: #69 of 287 inventorsTop 25%
Overall (2017): #127,443 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9780053 Method of forming a bondpad and bondpad Peter Scherl, Manfred Schneegans 2017-10-03
9756726 Electronic device and method of fabricating an electronic device Alexander Heinrich, Peter Scherl, Hans-Joerg Timme 2017-09-05