Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837381 | Method of forming a chip assembly with a die attach liquid | — | 2017-12-05 |
| 9756726 | Electronic device and method of fabricating an electronic device | Peter Scherl, Magdalena Hoier, Hans-Joerg Timme | 2017-09-05 |
| 9735126 | Solder alloys and arrangements | Manfred Mengel, Steffen ORSO, Thomas Behrens, Oliver Eichinger, Lim Fong +2 more | 2017-08-15 |
| 9689561 | Lighting unit for a large electrical device | Matthias Wiedenmann | 2017-06-27 |
| 9683278 | Diffusion solder bonding using solder preforms | Bernd Rakow | 2017-06-20 |
| 9673170 | Batch process for connecting chips to a carrier | Rupert Fischer, Peter Strobel, Joachim Mahler, Konrad Roesl | 2017-06-06 |
| 9576875 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Gunther Mackh +1 more | 2017-02-21 |