JH

Joachim Hirschler

Infineon Technologies Ag: 2 patents #173 of 917Top 20%
TW Technische Universität Wien: 1 patents #10 of 40Top 25%
Overall (2017): #139,135 of 506,227Top 30%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9673096 Method for processing a semiconductor substrate and a method for processing a semiconductor wafer Michael Roesner, Markus Heinrici, Gudrun Stranzl, Martin Mischitz, Martin Zgaga 2017-06-06
9614045 Method of processing a semiconductor device and chip package Srinivasa Reddy Yeduru, Harald Wiedenhofer, Franz Kleinbichler 2017-04-04