Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9614045 | Method of processing a semiconductor device and chip package | Joachim Hirschler, Harald Wiedenhofer, Franz Kleinbichler | 2017-04-04 |
| 9589880 | Method for processing a wafer and wafer structure | Karl Heinz Gasser, Stefan Woehlert, Karl Mayer, Francisco Javier Santos Rodriguez | 2017-03-07 |