Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666452 | Chip packages and methods for manufacturing a chip package | Guenter Tutsch, Horst Theuss, Manfred Engelhardt, Joachim Mahler | 2017-05-30 |
| 9589880 | Method for processing a wafer and wafer structure | Srinivasa Reddy Yeduru, Karl Heinz Gasser, Stefan Woehlert, Francisco Javier Santos Rodriguez | 2017-03-07 |