Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741618 | Methods of forming semiconductor devices | Martin Zgaga, Markus Kahn, Guenter Denifl | 2017-08-22 |
| 9704748 | Method of dicing a wafer | Joerg Ortner, Michael Roesner, Rudolf Rothmaler | 2017-07-11 |
| 9673096 | Method for processing a semiconductor substrate and a method for processing a semiconductor wafer | Joachim Hirschler, Michael Roesner, Markus Heinrici, Martin Mischitz, Martin Zgaga | 2017-06-06 |
| 9610543 | Method for simultaneous structuring and chip singulation | Thomas Grille, Ursula Hedenig, Michael Roesner, Martin Zgaga | 2017-04-04 |