Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837394 | Self-aligned three dimensional chip stack and method for making the same | Lawrence A. Clevenger, Carl Radens, John H. Zhang | 2017-12-05 |
| 9786551 | Trench structure for high performance interconnection lines of different resistivity and method of making same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise | 2017-10-10 |
| 9658523 | Interconnect structure having large self-aligned vias | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Terry A. Spooner +1 more | 2017-05-23 |
| 9659820 | Interconnect structure having large self-aligned vias | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Richard S. Wise, Akil Khamisi Sutton +2 more | 2017-05-23 |
| 9646939 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Byoung Youp Kim, Walter Kleemeier | 2017-05-09 |
| 9633986 | Technique for fabrication of microelectronic capacitors and resistors | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Edem Wornyo | 2017-04-25 |