HS

Hiroyuki Shinozaki

EB Ebara: 11 patents #1 of 168Top 1%
Overall (2017): #6,069 of 506,227Top 2%
11
Patents 2017

Issued Patents 2017

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
9849557 Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body 2017-12-26
9808908 Method of monitoring a dressing process and polishing apparatus 2017-11-07
9757838 Polishing apparatus having end point detecting apparatus detecting polishing end point on basis of current and sliding friction 2017-09-12
9707661 Polishing method and polishing apparatus 2017-07-18
9687957 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method Mitsuru Miyazaki, Seiji Katsuoka, Naoki Matsuda, Junji Kunisawa, Kenichi Kobayashi +5 more 2017-06-27
9687958 Wet treatment apparatus and substrate treatment apparatus provided with the same 2017-06-27
9666469 Lifting device, substrate processing apparatus having lifting device, and unit transferring method Kenji Shinkai, Tadakazu Sone, Hideo Aizawa, Hiroshi Aono, Toshio Yokoyama 2017-05-30
9662761 Polishing apparatus Nobuyuki Takahashi, Toru Maruyama, Suguru Sakugawa, Osamu Nabeya 2017-05-30
9616545 Exhaust flow rate control apparatus and substrate processing apparatus provided therewith 2017-04-11
9550268 Substrate holding apparatus and polishing apparatus 2017-01-24
9539699 Polishing method 2017-01-10