Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp | 2017-06-27 |
| 9564391 | Thermal enhanced package using embedded substrate | Kevin Hu | 2017-02-07 |