Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp | 2017-06-27 | $38,891,000 |
| 9564391 | Thermal enhanced package using embedded substrate | Kevin Hu | 2017-02-07 |