Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842827 | Wafer level system in package (SiP) using a reconstituted wafer and method of making | Rezaur Rahman Khan | 2017-12-12 |
| 9837378 | Fan-out 3D IC integration structure without substrate and method of making the same | Rezaur Rahman Khan | 2017-12-05 |
| 9772880 | Wireless bus for intra-chip and inter-chip communication, including adaptive link and route embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2017-09-26 |
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Edward Law, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp | 2017-06-27 |
| 9680002 | Semiconductor device with a variable-width vertical channel formed through a plurality of semiconductor layers | Frank Hui | 2017-06-13 |
| 9618560 | Apparatus and method to monitor thermal runaway in a semiconductor device | — | 2017-04-11 |
| 9612871 | Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2017-04-04 |
| 9570420 | Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package | Jesus Alfonso Castaneda, Arya Behzad, Ahmadreza (Reza) Rofougaran, Michael Boers | 2017-02-14 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Rezaur Rahman Khan, Pieter Vorenkamp, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Xiangdong Chen | 2017-01-17 |